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Chip Industry Technical Paper Roundup: Sept. 29

Technical paper roundup explores CFET scaling, packaging power delivery, and GPU memory structures

By GPU Data Hub Desk · GPU Data Hub·Editorial standards·

A compilation of newly published semiconductor research covers advancements spanning transistor scaling, packaging, and high-performance computing hardware. Notable topics include comparisons between CFET and nanosheet devices, multi-kilowatt power distribution for three-dimensional heterogeneous integration, and Rowhammer attack surfaces on graphics processors. The collection also examines concurrent memory architectures designed to accelerate inference workloads for large language models.

Original source

This summary was written by the GPU Data Hub desk from reporting published by Semiconductor Engineering on 29 Sept 2026, 07:01. Read the full article at the original publisher.

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