AMD schedules third-quarter results for 3 November
AMD will release its third-quarter 2026 results on 3 November after market close, with a management call at 5 p.m. Eastern Time.
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Semiconductors
Semiconductor news: foundry capacity, advanced packaging, HBM memory supply, export controls and the chip supply chain behind AI.
Chip Industry Week In Review
A weekly industry assessment highlights progress in sub-10-angstrom transistor scaling alongside rising infrastructure capital expenditure for data centre power and advanced packaging. The semiconductor sector simultaneously confronts severe workforce constraints, with tens of thousands of engineering posts required to support advancing optical and quantum architectures.
Software roared back last quarter. Cramer says these stocks can keep climbing
Shares in enterprise software providers staged a recovery last quarter, clawing back ground lost during an earlier artificial intelligence-led market sell-off. Concurrently, semiconductor equities experienced a period of cooling following substantial valuation gains during the opening half of the year.
Volantis Raises $88M Series A to Advance Photonic Memory Architecture
Semiconductor startup Volantis has secured $88 million in a Series A funding round jointly led by Abstract Ventures and Lachy Groom. The San Francisco-based firm intends to develop optical memory hardware tailored to accelerate AI inference for models with more than 20 trillion parameters at speeds up to 10,000 tokens per second per user.
Steam Deck 2: Is AMD Gainsborough the chip Valve’s been waiting for?
Speculation has mounted regarding an AMD chip designated Gainsborough, which industry watchers suggest could underpin an eventual successor to Valve's handheld console. Valve has previously maintained that developing a sequel requires a substantial generational advance in power efficiency and compute performance.
First Intel Panther Lake mini PC cooled with solid-state AirJet tech operates at less than 21 dBA — Aaeon claims its fanless Up Xtreme PTL Edge Air is also slimmer, lighter than actively-cooled rivals
Hardware manufacturer Aaeon has unveiled an edge computing system powered by Intel Panther Lake processors that utilises solid-state AirJet cooling mechanisms. The compact unit is claimed to operate under 21 decibels while achieving a thinner and lighter form factor than traditionally fan-cooled systems. The development marks an early commercial deployment of membrane-based thermal dissipation paired with Intel's latest silicon architecture.
Nvidia launches Open Agent Safety Platform to physically restrain rogue AI agents
Nvidia has launched the Open Agent Safety Platform, combining its OpenShell sandboxing environment with BlueField-powered Sentry hardware. The setup is designed to continuously monitor autonomous AI agents and isolate systems exhibiting unwanted or hazardous behaviours. By incorporating hardware-level controls, the platform offers data centre operators an enforceable containment mechanism for agentic deployments.
AI's chipmaking frontier may face patent infringement hurdles as autonomous tools take over
The growing adoption of autonomous AI design systems in semiconductor engineering is creating fresh uncertainty over intellectual property protection. As automated tools assume greater responsibility for circuit layout and silicon architecture, chipmakers face potential legal challenges regarding patent infringement and inventorship. The trend could complicate existing licensing and development frameworks across the electronics supply chain.
DeepSeek and Huawei release open-source Ascend AI programming tools to reduce reliance on Nvidia ecosystem
DeepSeek and Huawei have published open-source programming toolkits for the Ascend 950 artificial intelligence processor series. The distribution features dedicated communication and compute libraries built to facilitate software optimisation on Huawei silicon. The joint effort is intended to lessen domestic developer dependence on Nvidia's dominant software environment.
Micron lawsuit claims Chinese memory maker YMTC poached its engineers, then sued it using its own stolen tech
Micron Technology has launched legal action against Yangtze Memory Technologies, alleging the Chinese chipmaker recruited its technical personnel to unlawfully obtain proprietary semiconductor know-how. The US memory manufacturer contends that YMTC subsequently obtained patents on the misappropriated technology and asserted them in ongoing patent disputes. The case marks another escalation in intellectual property conflicts across the global memory chip supply chain.
The Hidden Challenges of Edge AI Design
Silicon designers face mounting friction as rapid iterations in artificial intelligence models outpace traditional semiconductor development cycles. Semiconductor architects must successfully reconcile flexible processing capabilities and data transfer constraints with comprehensive hardware security.
AI-Defined Vehicles Push Compute, Memory, And Validation Limits
The automotive industry's progression toward AI-defined platforms is placing unprecedented pressure on processing, storage, and testing frameworks. Industry observers are questioning whether underlying silicon architectures can scale sufficiently to satisfy these rising computational workloads.
Memory At The Edge: Non-Volatile Memory Challenges And Requirements For Humanoid Robots
Emerging humanoid robotics platforms are imposing rigorous operating requirements on non-volatile memory technologies deployed at the edge. Distributed architectures must provide high endurance for telemetry capture whilst maintaining functional safety and deterministic networking in demanding environments.
Open Security Foundations Are Only The Beginning: Deploying Caliptra Hardware in Production
Hardware-based roots of trust are increasingly expanding into broader security orchestration roles across computing platforms. Implementations leveraging the open-source Caliptra specification are now shifting into live production environments to underpin system integrity.
Why LLMs Are The Best Thing To Happen To Chip Design
Large language models are transforming semiconductor engineering by offering more intuitive methods for expressing hardware architecture intent. This evolution enables designers to move past traditional register-transfer level constraints to accelerate chip synthesis and verification.
We're raising our Micron price target after an incredible quarter and robust guidance
Financial analysts have raised their price target for Micron on the back of impressive quarterly performance and optimistic guidance. The semiconductor manufacturer indicated that customer demand for its memory hardware is projected to surpass available manufacturing supply through fiscal 2027.
CScale Exits Stealth with $145M to Build the Interconnect for Gigawatt-Scale AI
Optical networking developer CScale has emerged from stealth mode alongside a $145 million Series C funding round, lifting its aggregate capital raised to $188 million. The firm is developing ultra-low-latency, high-bandwidth optical interconnects designed to link accelerators together across gigawatt-scale artificial intelligence installations.
Huawei boss claims homegrown AI chip sales top Nvidia in China
Huawei rotating chairman Eric Xu has stated that domestic shipments of the company's artificial intelligence processors have overtaken Nvidia within mainland China. Although acknowledging a performance deficit compared to rival silicon, Xu stressed that immunity from foreign trade restrictions provides domestic customers with vital supply stability.
Synopsys and Amazon sign $1bn multi-year IP agreement for custom chip development
Synopsys has concluded a multi-year intellectual property contract valued at $1 billion with Amazon to support custom processor development. Under the agreement, the cloud giant will serve as the anchor customer for the design software vendor's expanded silicon IP portfolio.
AI Chip Design Week
Tom's Hardware has initiated focused coverage under its AI Chip Design Week editorial programme. The series centres on architectural and engineering trends surrounding silicon engineered for artificial intelligence computing.
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