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Micron details ambitious DRAM and NAND roadmap — 3D NAND, High-NA EUV, new materials, and custom silicon makes a comeback

Micron outlines next-generation memory roadmap to tackle AI workload bottlenecks

By GPU Data Hub Desk · GPU Data Hub·Editorial standards·
Micron details ambitious DRAM and NAND roadmap — 3D NAND, High-NA EUV, new materials, and custom silicon makes a comeback

Micron has outlined its forward-looking roadmap across DRAM and NAND flash, incorporating High-NA EUV lithography alongside novel materials. The company is also re-embracing bespoke silicon architectures as developers confront throughput and capacity bottlenecks with existing memory hardware for artificial intelligence workloads.

Original source

This summary was written by the GPU Data Hub desk from reporting published by Tom's Hardware on 4 Nov 2026, 14:00. Read the full article at the original publisher.

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