Vertical DRAM Stacking Expands Thermal Design Space Beyond HBM-on-GPU (imec)

Research institute imec has analysed a novel three-dimensional memory layout that positions vertically oriented DRAM dies directly over a graphics processor. Thermal simulations indicate that integrating cooling channels within the structure provides a viable alternative to standard high-bandwidth memory packaging. The work evaluates how stack dimensions and memory density influence overall heat dissipation.