Semiconductors
Semiconductor manufacturer with data-center CPUs, Gaudi AI accelerators and a foundry business.
Amazon Web Services has launched a public preview of its AWS Well-Architected Agent, an intelligent cloud analysis offering. The system monitors customer environments to provide contextual guidance that improves operational expenditure, application resilience, security, and infrastructure efficiency.
Hardware manufacturer Aaeon has unveiled an edge computing system powered by Intel Panther Lake processors that utilises solid-state AirJet cooling mechanisms. The compact unit is claimed to operate under 21 decibels while achieving a thinner and lighter form factor than traditionally fan-cooled systems. The development marks an early commercial deployment of membrane-based thermal dissipation paired with Intel's latest silicon architecture.
A directive from Donald Trump has reportedly ordered United States federal agencies to adopt the designation 'Super Intelligence' across official records. The administrative shift replaces earlier terminology across government documentation, though observers have raised questions over associated domain registrations. The move signals an official terminology pivot for federal computing and technological policy.
Donald Trump has pressed to rebrand artificial intelligence as 'super intelligence' amidst shifting political approval ratings. The US president downplayed suggestions that his promotion of data centre buildouts and machine intelligence could impact his party during upcoming legislative elections.
A presidential executive order signed by Donald Trump has directed the US executive branch to formally adopt the phrase 'Super Intelligence'. Under the mandate, federal websites, statements, and policy paperwork are instructed to abandon the traditional term artificial intelligence entirely.
Intel has cleared compliance and interoperability testing with both the USB-IF and PCI-SIG standards bodies for its upcoming Nova Lake architecture. The certifications cover the Core Ultra 400-series processors and supporting chipsets as the company prepares the platform for market release.
Intel has detailed a patent filed in 2022 that describes incorporating MicroLEDs directly into semiconductor packages. Beyond diagnostic reviews and surface lighting, the architecture could act as an alternative pathway for co-packaged optics. The mechanism may assist embedded optical interconnects using through-glass vias to enhance chip-level communication.