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Intel patent embeds MicroLEDs in chip packaging — technology may enable embedded optical interconnects through TGVs

Packaging patent explores MicroLED integration to advance co-packaged optics

By GPU Data Hub Desk · GPU Data Hub·Editorial standards··United States
Intel patent embeds MicroLEDs in chip packaging — technology may enable embedded optical interconnects through TGVs

Intel has detailed a patent filed in 2022 that describes incorporating MicroLEDs directly into semiconductor packages. Beyond diagnostic reviews and surface lighting, the architecture could act as an alternative pathway for co-packaged optics. The mechanism may assist embedded optical interconnects using through-glass vias to enhance chip-level communication.

Original source

This summary was written by the GPU Data Hub desk from reporting published by Tom's Hardware on 29 Sept 2026, 10:30. Read the full article at the original publisher.

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